Paint-Free Material Green Aesthetics Solution

The self-developed paint-free soft-gloss colored aluminum effect, with its unique metallic texture and environmental advantages, provides a green aesthetics solution for fields such as 3C electronics (Computer, Communication, and Consumer Electronics) and automotive interiors. This technology eliminates the need for painting processes, reducing environmental pollution and production costs, while its unique metallic texture meets consumers' high-quality demands for product appearance.

Continuous Glass Fiber Reinforced Thermoplastic Composites Solution

Continuous glass fiber reinforced thermoplastic composites are applied in new energy vehicle battery packs, achieving a 67% weight reduction compared to traditional solutions. The tensile strength exceeds 300 MPa, and the material can withstand continuous ablation under a 1000°C high-temperature flame for 60 minutes without burn-through, providing precious escape time for passengers and offering strong assurance for the safety performance of new energy vehicles.

EB-Cured Lightweight Photovoltaic Backsheet Solution

The EB-cured lightweight photovoltaic backsheet adopts a new process featuring solvent-free, low-energy, and room-temperature curing, eliminating VOCs emissions and solvent residue. Meanwhile, molecular-level cross-linking and curing is achieved through electron beam irradiation, enhancing coating density and interfacial adhesion. This effectively resolves the aging and delamination issues of traditional backsheets, helping the photovoltaic industry reduce costs and improve efficiency, and driving the photovoltaic sector toward a greener and more efficient direction.

Cross-Linkable PA Hot-Melt Adhesive Product Solution

Addressing the encapsulation challenges of precision components in the electrical and electronics industry, CGN Juner has developed the cross-linkable PA hot-melt adhesive product based on PA-LX irradiation cross-linking technology. Through irradiation treatment, this product builds a three-dimensional network structure between molecular chains, achieving the technical breakthrough of "low-temperature injection molding, high-temperature application." It fundamentally resolves the contradiction between the processing temperature and service temperature of traditional materials, providing a more efficient and reliable solution for the encapsulation of electrical and electronic products.